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printed circuit boards of instruments as for the measurement of depths or altitude, where the surrounding pressure is measured.
TAB (Tape Automated Bonding) is a special process for contacting the diffused resistors on the chip. The resistor aluminum contacts are provided with 0,1 mm thick gold bumps. The pretinned ends of the copper strips on the flexible circuit material are soldered to the these goldbumps. Each contact is able to withstand a force of more than 1 Newton. TAB bonded cells withstand extreme conditions in shock or vibration. TAB bonded cells may be surrounded by high viscosity gels or mouldings in water depth instruments without danger of contact braking as with wire bonded cell.