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Features
Even with small form factor, sensitive enough for direct IC-driving
The dimensions of this high-density 4-gap balanced armature are 31 mm 14 mm 11 mm 1.220 inch .551 inch .433 inch. Despite this small size, high sensitivity is achieved by a mechanism that incorporates high-efficiency polarized magnetic circuits along with our exclusive spring alignment method. With an minimum operating power of about 150 mW, nominal operating power of 240 mW, this relay can be directly driven by transistor or chip controllers.
High switching capability
Strong against lamp inductive loads, maximum switching capacity has reached 3,040 VA (8A 380V AC).
High breakdown voltage - Optimal for control in 250 V power circuits
High breakdown voltage has been achieved. Between contacts and coil of 3,750 Vrms; Surge breakdown voltage between coil and contact of 6,000 V, and between open contacts of 1,200 Vrms mean that these relays are suitable even for 250 V power circuit control.
Improved stability
Conforms to all types of safety standards.
Insulating distance of more than 3 mm secured. Complies with Japan Electrical Appliance and Material Safety Law requirements for operating 200 V power supply circuits, and conforms with UL, CSA and VDE standards.
Latching types available
In addition to single side stable types, convenient 2 coil latching types with memory functions are also available. Moreover, we offer 2 Form A specifications which, with double pole switching for applications such as 250 V power circuit switching, can enable safer designs.
Automatic cleaning possible
The sealed design means that these relays can undergo immersion in automatic washing systems and are suitable for automatic soldering. Even in difficult environments, the contacts remain reliable.
Easy to design PC board patterns
Features 4/10 dual-in-line terminals. Because the lead spacing has a pitch greater than 7.54 mm .297 inch, designers can make easy adjustments with the width of the land size. This, along with the large insulation distance, simplifies the drawing of PC board patterns.
To improve soldering efficiency, preapplication of solder to the terminals is recommended.